TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacking — techl8

TechTom's Hardware1h ago

TSMC SoIC 3D stacking roadmap outlines path from 6-micron pitches today to 4.5-micron in 2029 — Fujitsu's Monaka CPU to benefit from face-to-face chiplet stacking

TSMC adds support for face-to-face stacking, 6.5 µm and 4.5 µm pitches for the next generation of SoIC 3D stacking.

Source: Tom's Hardware · Opens in new tab