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SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A

SMIC's third-gen 7nm node shows smaller metal pitch than Intel 18A, higher transistor density than TSMC N6 without EUV — analysis of N+3 shows significant advancement for Chinese semi manufacturing

SMIC's N+3 process technology can achieve transistor density comparable to TSMC's N6 without using EUV lithography, but it fails to deliver performance or efficiency of modern production nodes.

Source: Tom's Hardware · Opens in new tab