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SK Hynix breaks ground for its $4B advanced memory chip packaging
SK Hynix breaks ground for its $4B advanced memory chip packaging facility in Indiana, with mass production of next-generation HBM scheduled to begin in H2 2029
TL;DRSK Hynix is building a $4B chip packaging plant in Indiana, starting production in late 2029.
Why it matters: Reduces supply chain risk for high-demand AI chips; strengthens US semiconductor independence from Asia.
SK Hynix Inc. held a groundbreaking ceremony Thursday for its advanced memory packaging facility in Indiana …
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