Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration — techl8

TechTom's Hardware4h ago

Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration

The rally followed a report claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's EMIB technology.

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