techl8

Huawei develops 122TB SSD with new packaging tech

Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage…

Source: Tom's Hardware · Opens in new tab