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Wednesday, 15 July 2026
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Cadence unveils AuraStack AI Super Agent, an AI platform for PCB

Cadence unveils AuraStack AI Super Agent, an AI platform for PCB and advanced chip packaging design, with Nvidia, TSMC, and Schneider Electric among early users

As systems and AI infrastructure get more complex, the engineering challenges required to design and bring them to market extend well beyond silicon.

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